Lead-free low silver solder paste "FLF30-AZ"
Intentionally added Ni and Ge to the low-silver type that emphasizes low cost! Connection reliability has significantly improved.
The "FLF30-AZ" suppresses the growth of intermetallic compound layers due to the intentional addition of Ni, resulting in improved connection reliability. Additionally, it has transitioned from a conventional Ag3% alloy to an Ag1% alloy, and the reduction in the amount of expensive Ag has been mitigated by the new development of flux, which has improved wetting performance. 【Features】 ○ Suppresses the growth of intermetallic compound layers through intentional addition of Ni ○ Improved connection reliability ○ Significant cost reduction by reducing the amount of expensive Ag ○ Improved wetting performance due to the new development of flux ● For more details, please download the catalog or contact us.
- Company：松尾ハンダ 本社大和工場
- Price：Other
